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LW-PLA outstanding
I got to test out printing LW-PLA, that is low weight PLA, which will expand (foaming) at higher temperatures. When printed at 200F, no expansion occurs, and the layers are easy to separate (not good for R/C), but at 250F with half the extrusion rate, the layers bond so well that I was not able to separate the layer with any reasonable force. You do have to print slower. Certainly looking promising for R/C.
I'm printing the right wing inner panel at the moment - was to be 36 hours on a 0.4mm nozzle, so I switched to 0.8mm nozzle and doubled layer height, its down to 9 hours. Patience!
I've attached yet another OpenSCAD revision, very much different and improved.
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